SK Hynix Begins Construction of $4 Billion Advanced Memory Packaging Facility in Indiana

SK Hynix Inc. held a groundbreaking ceremony on Thursday, August 27, 2026, for its advanced memory packaging facility in Indiana. The over $4 billion plant, backed by the US CHIPS and Science Act, will be the company's first high-bandwidth memory (HBM) packaging base in the U.S. and is expected to create about 1,000 jobs. Mass production of next-generation HBM is scheduled to begin in the second half of 2029.