TSMC and ASML Announce Collaborative Initiative for Large-Format Photomasks in High NA EUV Lithography

Taiwan Semiconductor Manufacturing Company (TSMC) and ASML Holding N.V. have formed a collaborative industry initiative to transition to larger-format Extreme Ultraviolet (EUV) lithography photomasks. This move aims to increase fab productivity, lower chipmaking costs, and remove stitching constraints, benefiting the entire semiconductor industry. The initiative targets establishing a 12-inch mask pilot line by 2031, supporting full lithography system readiness for advanced node production by 2033.