MIT Researchers Develop Shape-Shifting 'Bifur-Circuits' for Smart Devices

MIT researchers have developed 'bifur-circuits,' novel 3D-printed modular metamaterials that enable smart devices to change shape while maintaining electrical connections and recognizing their own configuration. Tests showed these conductive connections endured over 10,000 compression cycles. This innovation could lead to adaptable rehabilitation devices, robotic grippers, and reconfigurable shelters, significantly advancing the field of smart materials and robotics with practical applications.