Advanced Semiconductor Packaging Shortage Drives Long-Term Deals and Intel Foundry Expansion

A shortage in advanced semiconductor packaging is prompting long-term contracts, with TSMC reportedly securing a decade-long agreement and tool makers receiving orders through 2030. In response to these supply chain pressures, Intel is establishing its own packaging-focused foundry and is rumored to be collaborating with UMC on advanced processes, signaling a strategic industry shift.