TSMC's First-Generation CoPoS Advanced Packaging Technology May Be Glass-Free

Contrary to market expectations of a 'glass revolution,' TSMC's highly anticipated panel-level packaging technology, CoPoS, is likely to adopt a 'zero-glass' solution for its first generation. While CoPoS is expected to enter volume production in the first half of 2029, this development suggests that initial implementations will utilize a glass carrier as a temporary support rather than integrating glass as a core material, potentially impacting supply chain narratives.