Apple Signs Over $30 Billion Deal with Broadcom for U.S. Wireless Chip Production

Apple has entered a landmark multi-year agreement with Broadcom, valued at over $30 billion, to design and produce advanced wireless chips within the United States. This deal, Apple's largest single commitment under its American Manufacturing Program, is expected to generate more than 15 billion U.S.-made chips and includes a $1.5 billion expansion of Broadcom's Fort Collins, Colorado facility. The partnership extends through 2031 and focuses on critical components for iPhone, iPad, and Mac connectivity.