SK hynix Reportedly Developing 3D-Stacked DRAM for On-Device AI

SK hynix is reportedly increasing its focus on 3D-stacked DRAM, a next-generation memory technology vital for on-device AI applications. The company is actively recruiting engineers for 3D-Stacked DRAM-on-Logic design through its US subsidiary and is believed to be collaborating with a specific customer. This strategic development aims to overcome memory bottlenecks in AI by integrating memory and logic for improved performance and power efficiency.