TSMC Accelerates 2nm Capacity Expansion as Samsung Secures Major AI Chip Deal with Broadcom

TSMC is rapidly expanding its 2nm production capacity across five fabs in Taiwan due to strong demand, with the Baoshan site reaching a monthly capacity of 20,000 wafers. Concurrently, Samsung has signed a significant deal with Broadcom to collaborate on memory and foundry technologies, focusing on using Samsung's HBM4 memory in Broadcom's AI accelerators and ramping up 2nm production, intensifying competition in the advanced semiconductor market.