Japan's METI Tightens Semiconductor Export Controls, Affecting Advanced Packaging Equipment

Japan's Ministry of Economy, Trade and Industry (METI) has implemented revised semiconductor export controls under its Foreign Exchange and Foreign Trade Act, effective August 1, 2026, after the transition period ended. The new regulations add 20 categories of controlled items, including advanced packaging equipment such as TSV silicon through-hole tools, ultra-thin wafer thinning machines, and laser stealth dicing machines. These changes replace general licensing with case-by-case approvals, reflecting the growing strategic importance of semiconductor technology.