Researchers Achieve 0.42-Nanometer Semiconductor Breakthrough for Next-Generation Chips

Researchers from National Yang Ming Chiao Tung University and TSMC have engineered an atomic interface to overcome a major engineering barrier in atomically thin semiconductors. This breakthrough, achieving a 0.42-nanometer chip, could enable dramatically smaller, faster, and more energy-efficient transistors by protecting electron flow while allowing extremely thin insulating layers.