Odisha to gain over 1,200 direct jobs from new semiconductor manufacturing projects under Semicon India Programme

The Indian government has approved two semiconductor manufacturing projects in Odisha under the Semicon India Programme, which are expected to create more than 1,280 direct jobs. These projects include a vertically integrated facility for advanced packaging and embedded glass substrate manufacturing by 3D Glass Solutions Inc (3DGS) and a silicon carbide (SiC)-based compound semiconductor fabrication and ATMP facility by SicSem Private Limited.