Glass Substrates Emerge as Next-Generation Chip Packaging Battleground, Challenging CoWoS

Glass substrates are emerging as a critical next-generation packaging technology in the semiconductor industry, presenting an opportunity for countries like Korea to gain a lead in advanced packaging. This development is seen as a potential challenge to existing technologies like TSMC's CoWoS, as the performance of components in high-bandwidth memory (HBM) and other advanced products increasingly relies on innovative packaging solutions.