Coherent Samples 300mm SiC Substrates to Address AI Processor Thermal Management

Coherent, a leader in advanced materials, has begun sampling 300mm high-thermal-conductivity silicon carbide (SiC) substrates to key semiconductor partners in the AI sector. These substrates are engineered to address the primary bottleneck of thermal management in modern AI processors, offering an approximate 25% improvement in thermal performance and supporting next-generation heat spreaders and advanced packaging architectures.