E&R Engineering Unveils High-Precision Laser Drilling and Hybrid Plasma Solutions for Advanced Semiconductor Packaging

E&R Engineering has showcased new high-precision laser drilling and advanced hybrid plasma solutions at SEMICON Taiwan 2026. These technologies address the growing demand for high-density optical components in high-speed optical communications and Co-Packaged Optics (CPO), as well as the increasing importance of glass substrates for AI, HPC, and advanced packaging.