SK hynix Begins Construction of $4 Billion U.S. HBM Production Facility

SK hynix has initiated construction of its first U.S. High Bandwidth Memory (HBM) production base at Purdue University in Indiana, representing an investment exceeding $4 billion. This advanced packaging fab for AI memory aims to open its cleanroom by October 2028 and commence mass production of next-generation HBM in the latter half of 2029. The project is set to significantly enhance the U.S. semiconductor ecosystem and AI memory supply chain.