SK hynix Begins Construction of U.S. HBM Production Facility in Indiana

SK hynix has started building an advanced packaging facility in West Lafayette, Indiana, for High Bandwidth Memory (HBM) chips, vital for AI applications. This over $4 billion investment will establish a key U.S. HBM production hub, creating approximately 1,000 jobs. Mass production is expected by late 2029, integrating with Korean operations to supply U.S. customers.