SK Hynix Breaks Ground on $5 Billion Advanced Memory Packaging Facility in Indiana for AI Chips

SK Hynix has commenced construction on a $5 billion advanced memory packaging facility in Indiana, marking a significant step in strengthening the domestic supply chain for AI chips. The plant, expected to open by October 2028, will be SK Hynix's first high-bandwidth memory (HBM) packaging base in the U.S., with mass production of next-generation HBM slated for the second half of 2029.