SK hynix Breaks Ground on $4 Billion Indiana HBM Packaging Plant

SK hynix has commenced construction on a new 133-acre advanced-packaging facility in West Lafayette, Indiana, with an investment exceeding $4 billion. The plant is slated to begin mass production of next-generation high-bandwidth memory (HBM) in the second half of 2029, connecting South Korean DRAM production with U.S. customers building AI systems. The project received up to $458 million in CHIPS Act funding and up to $500 million in federal loans and Indiana incentives.