Semicon Taiwan to Highlight Co-Packaged Optics and Silicon Photonics for AI Infrastructure

The upcoming Semicon Taiwan trade show will feature co-packaged optics (CPO) and silicon photonics as key themes, technologies deemed crucial for addressing the escalating bandwidth demands of artificial intelligence (AI) infrastructure. Event organizer SEMI indicated that firms are accelerating the commercialization of these technologies as the industry moves beyond chip-level speeds to enhance rack-to-rack links.