TSMC Executive Predicts Silicon Photonics to Exceed 50% Penetration by 2027, Driven by AI Scale-Out

A TSMC executive has projected that silicon photonics will surpass 50% market penetration by 2027, with Co-Packaged Optics (CPO) mass production beginning in the second half of the year. This growth is primarily fueled by the demand for high-speed data in AI scale-out, indicating a significant shift in optical transceiver technology and its impact on future AI infrastructure.