SK Hynix Reportedly Explores Partnership with Intel Foundry for HBM4E Chip Production

SK Hynix is reportedly considering a strategic partnership with Intel's foundry division for the production of substrate chips for its next-generation High Bandwidth Memory (HBM4E) products. This move aims to diversify SK Hynix's supply chain and reduce its reliance on TSMC for substrate manufacturing, potentially enhancing cost-efficiency and supply stability. The collaboration could also extend to advanced packaging capabilities.