TSMC Unveils Aggressive AI Computing Roadmap, Projects 50x Performance Boost by 2029 Driven by SoIC, CoWoS, and Silicon Photonics

TSMC detailed its advanced technology roadmap at SEMICON Taiwan 2026, aiming to meet escalating AI computing demand. The company anticipates that the integration of its SoIC and CoWoS technologies will increase overall system computing performance by 50 times its 2024 level by 2029. Additionally, TSMC expects silicon photonics to account for over 50% of the optical transceiver market by 2027, with some suppliers beginning mass production of Co-Packaged Optics (CPO) in the second half of 2026.