Micron Plans to Double HBM Production Capacity by Year-End

Micron Technology Inc. announced aggressive equipment investments to double its high-bandwidth memory (HBM) production capacity compared to last year. This strategic move aims to enhance supply for next-generation HBM4 12-layer products by year-end, targeting increased market share in the rapidly growing AI sector, where HBM4 will be utilized in Nvidia's Vera Rubin chips.