Semiconductor Industry Sees Major Advances in AI Chip Packaging and Manufacturing Capacity

The semiconductor industry is witnessing significant advancements in AI chip packaging and manufacturing. Simmtech plans a 400 billion won capacity expansion for AI package substrates, driven by accelerating demand from TSMC and OSAT customers. Hanmi Semiconductor unveiled new 2.5D AI chip packaging equipment at SEMICON Taiwan 2026, targeting advanced heterogeneous integration for next-generation AI processors. Additionally, SUSS and Manz Asia announced a strategic collaboration to develop next-generation inkjet solutions for semiconductor manufacturing and advanced packaging applications.