Samsung Reportedly Plans In-House Silicon Photonics PIC Testing by End-2026

Samsung is reportedly enhancing its silicon photonics development by bringing photonic integrated circuit (PIC) wafer testing capabilities in-house, with plans to complete this by the end of 2026. The company is utilizing probe stations from FormFactor and MPI, which are qualified by TSMC for Co-Packaged Optics (CPO)-related testing. This move is part of Samsung's broader silicon photonics roadmap, aiming for mass production in the second half of 2026 and eventually integrating optical engines with logic chips and HBM.