ASML Expands High NA EUV Collaborations with Samsung, TSMC, and Intel for Next-Generation Semiconductor Manufacturing

ASML is deepening its strategic partnerships with major chip manufacturers Samsung, TSMC, and Intel to advance High Numerical Aperture (High NA) Extreme Ultraviolet (EUV) lithography and transition to larger 12-inch photomasks. Samsung plans to adopt High NA EUV for future DRAM manufacturing by 2028, while TSMC aims for 2030. Intel Foundry is already using High NA EUV in high-volume manufacturing for select layers of its Intel Core Ultra Series 3 processors. This concerted industry effort is expected to increase fab productivity, lower chipmaking costs, and remove stitching constraints, driving innovation in the AI era.