TSMC Plans High-NA EUV Lithography for Chip Production by 2030

AI-generated NewsSnap summary based on source reporting.
Published: 2026-09-08T16:26:10Z
Category: technology
Source: Tom's Hardware
Original source

Taiwan Semiconductor Manufacturing Company (TSMC) intends to implement advanced High-NA EUV lithography for high-volume chip manufacturing by 2030. This technology, offering 8nm single-exposure resolution, is slated for future A10 or A11 process nodes. This development is crucial for advancing semiconductor fabrication and enabling next-generation chip performance.

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