ASML and TSMC Announce Initiative to Pioneer Industry Transition to Large-Format Photomasks for High NA EUV

ASML and TSMC have announced a collaborative initiative to lead the semiconductor industry's transition to larger-format Extreme Ultraviolet (EUV) lithography photomasks. This move is expected to increase fab productivity, lower chipmaking costs, and remove stitching constraints, enabling more cost-effective production of future generations of leading-edge chips. Samsung also plans to adopt ASML's High NA EUV lithography for DRAM manufacturing by 2028, with TSMC aiming for 2030.