ASML and TSMC Collaborate to Advance 12-inch EUV Photomask Technology

ASML and TSMC are collaborating to transition the semiconductor industry to larger 12-inch extreme ultraviolet (EUV) lithography photomasks for advanced chip manufacturing. This partnership supports ASML's expansion, including a new production campus, to address increasing AI-driven chip demand. The initiative is projected to reduce chipmaking costs by 2033.