ASML and TSMC Champion 12-Inch Photomasks for Next-Generation High-NA EUV Lithography

ASML and TSMC are leading an industry shift towards larger 12-inch photomasks for High Numerical Aperture (High-NA) EUV lithography. This move is crucial for chipmakers preparing for the next stage of semiconductor scaling, driven by the increasing demand for denser and more complex chips for AI and high-performance computing. Samsung has joined the initiative, while Intel has already deployed High-NA EUV in production.