Samsung and ASML Deepen Partnership for High NA EUV Lithography in Next-Gen Chip Manufacturing

Samsung Electronics and ASML have expanded their strategic partnership to accelerate the development and deployment of High NA EUV lithography and advanced semiconductor manufacturing technologies. Samsung plans to integrate ASML's High NA EUV lithography into future DRAM high-volume manufacturing by 2028, aiming to increase fab productivity and lower chipmaking costs for leading-edge chips.