Micron Plans to Double HBM Production Capacity by End of 2026 Amid Surging AI Demand

Micron Technology is aggressively expanding its high-bandwidth memory (HBM) production, aiming to add 60,000 HBM wafer starts per month by the end of 2026, which would double its monthly capacity to approximately 100,000 wafers. This significant capacity push is driven by the accelerating demand for AI accelerators and the company's transition towards HBM4, with its 36GB 12-high HBM4 already in volume production for NVIDIA's Vera Rubin platform.