TSMC Reportedly Plans to Double CoWoS Capacity by 2028 Amid AI Chip Shortage

AI-generated NewsSnap summary based on source reporting.
Published: 2026-09-12
Category: technology
Source: Wccftech

A new report indicates that TSMC intends to double its CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging capacity by 2028. This expansion aims to address the ongoing shortage of AI chips, which has impacted rivals and the broader semiconductor industry.

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