TSMC Targets Significant Capacity Boost for 2nm, 3nm, and CoWoS by Mid-2027

TSMC is reportedly planning a substantial expansion of its advanced manufacturing capacity, targeting a 22% increase in 2nm and over 16% in 3nm chip production by mid-2027 from the end of 2026. Additionally, the foundry giant aims to double its CoWoS advanced packaging capacity from approximately 130,000 wafers per month by the end of 2026 to 260,000 by the end of 2028. This aggressive expansion is driven by booming AI demand and positions 3nm to become TSMC's largest revenue contributor, surpassing 5nm.