TSMC to Massively Expand Advanced Process Capacity Next Year; 2nm and 3nm Monthly Output to Surge

Taiwan Semiconductor Manufacturing Company (TSMC) is significantly increasing its capital expenditure for advanced process technologies, raising its full-year capex guidance to $60–64 billion. Approximately 70–80% of this investment is allocated to advanced processes, aiming to meet the surging demand for AI chips. The company is expanding its CoWoS (Chip-on-Wafer-on-Substrate) capacity and accelerating the development of next-generation process technologies like A14, A13, and A12, in collaboration with ASML. This expansion is expected to boost 2nm and 3nm monthly output and positively impact the semiconductor equipment and materials supply chain.