TSMC reportedly targets significant capacity boost for 2nm and 3nm processes by mid-2027

TSMC is reportedly planning a substantial expansion of its advanced manufacturing capabilities, aiming to increase 2nm capacity by 22% and 3nm capacity by over 16% from late 2026 to mid-2027. Additionally, its CoWoS advanced packaging capacity is expected to double by 2028, driven by strong demand and the 3nm process becoming a major revenue contributor.