TSMC Reportedly Targets Significant 2nm and 3nm Capacity Boost by Mid-2027

TSMC is reportedly planning a substantial expansion of its advanced semiconductor manufacturing capacity, targeting a 22% increase in 2nm capacity and over 16% in 3nm capacity from the end of 2026 to mid-2027. This aggressive ramp-up aims to meet growing demand, with 2nm capacity projected to reach 110,000 wafers per month and 3nm capacity increasing to 210,000 wafers per month. The foundry giant is also adding three new 3nm fabs across Taiwan, Arizona, and Japan, and converting existing 5nm equipment to support additional 3nm production. These investments underscore TSMC's commitment to advanced process technologies, with 70-80% of its 2026 capital spending allocated to this area.