TSMC to Expand Advanced Chip Packaging Capacity in Taiwan

TSMC reportedly plans to construct five new advanced packaging plants at the Chiayi Science Park, aiming to create the world's largest and most advanced packaging hub. This expansion is driven by strong demand from key clients like Nvidia, AMD, and Apple for advanced packaging technology, crucial for AI and high-performance computing chips. The move reinforces Taiwan's central role in the global semiconductor supply chain.