Singapore Inaugurates First High-End FC-BGA Substrate Manufacturing Facility

Advanced Substrate Technologies (AST), a joint venture of TOPPAN Holdings and Broadcom, has opened Singapore's inaugural high-end Flip Chip Ball Grid Array (FC-BGA) substrate plant. This facility aims to alleviate a critical supply chain bottleneck for components essential to AI, networking, and next-generation computing chips, addressing the surging global demand.