Samsung Predicts HBM to Account for Nearly 30% of Industry DRAM Capacity by 2027

Samsung Electronics projects that High Bandwidth Memory (HBM) will comprise nearly 30% of the DRAM industry's total wafer capacity by 2027, a significant increase from approximately 20% currently. This surge in HBM demand, driven by AI, is expected to constrain conventional DRAM supply as both compete for the same wafer capacity. Samsung itself plans to significantly expand its HBM capacity, with HBM4 family products potentially accounting for 80% of its HBM shipments next year.