HBM Expansion Drives Samsung-SK Hynix DRAM Rivalry as 30% of DRAM Wafer Capacity Shifts to HBM

Samsung Electronics projects that approximately 30% of global DRAM wafer production capacity will be allocated to High Bandwidth Memory (HBM) manufacturing next year, a significant increase from the current 20%. This shift is primarily driven by the escalating demand for AI infrastructure and is expected to impact the supply of general DRAM used in PCs and smartphones.