Broadcom and Toppan Open Singapore's First Advanced Chip Substrate Facility

Broadcom and Japan's Toppan Holdings have inaugurated Singapore's first advanced chip substrate plant, operated by their joint venture Advanced Substrate Technologies (AST). The facility will produce high-end Flip-Chip ball grid array (FC-BGA) substrates, crucial components for high-performance computing chips, aiming to alleviate a persistent bottleneck in the AI chipmaking and data center construction supply chain.