Nanya Technology Approved for New 3D Wafer Packaging Plant

DRAM chipmaker Nanya Technology Co. has received approval from the Southern Taiwan Science Park Administration to construct an advanced 3D wafer packaging and testing plant in Pingtung County. The facility will focus on developing through-silicon vias (TSVs) and wafer stacking technologies to vertically integrate DRAM chips. This aims to maximize capacity and bandwidth while minimizing latency, marking a significant investment in advanced semiconductor manufacturing.