Applied Materials and Intel Partner to Accelerate Chipmaking Innovations for AI

Applied Materials and Intel Corporation are collaborating to accelerate the development of chipmaking innovations for next-generation transistors, interconnects, and advanced packaging technologies crucial for AI computing. This partnership leverages capabilities at Applied's EPIC Center and Intel's R&D campus to shorten the time-to-market for advanced semiconductor technologies, including those for Foveros-based 3D stacking.