Applied Materials and Intel Partner to Accelerate AI Chip Advanced Process and Packaging Development

Applied Materials and Intel have announced an expanded collaboration to accelerate the development of next-generation transistors, interconnects, and advanced packaging technologies. This partnership aims to meet the increasing demands of AI computing by integrating Applied Materials' EPIC Center with Intel's R&D campus. The joint effort will focus on materials and process technologies for advanced logic process nodes and Intel's Foveros 3D stacking platform, targeting improvements in interconnect density, power delivery, and thermal performance.