Applied Materials and Intel Expand Collaboration for Next-Generation AI Chip Development

Semiconductor equipment giant Applied Materials and chipmaker Intel have announced an expanded collaboration to accelerate the development of next-generation transistors, interconnects, and advanced packaging technologies. This partnership aims to meet the increasing demands of artificial intelligence (AI) computing by breaking through traditional scaling limitations and advancing materials engineering. The initiative will integrate Applied Materials' EPIC Center with Intel's R&D campus to shorten the timeline from lab to high-volume manufacturing.