Intel Expands Collaboration with Applied Materials at New Chip Research Facility

Intel is deepening its partnership with Applied Materials at the new $5 billion EPIC Center in Silicon Valley. This collaboration, also involving TSMC, focuses on developing next-generation transistors, interconnects, and advanced packaging technologies. The joint effort aims to enhance materials and processes for AI workloads, particularly through Foveros-based 3D stacking for high-performance computing.