GlobalFoundries to Supply TSMC with U.S.-Made Silicon Interposers for AI Chips

GlobalFoundries has signed a five-year, $2 billion agreement to provide TSMC with U.S.-based silicon interposers, critical components for advanced AI chip packaging. This deal necessitates expanding GF's manufacturing capacity at its Malta, New York, facility, with volume production expected to commence in the first half of 2028. The agreement underscores the growing demand for AI chip components and efforts to strengthen domestic semiconductor supply chains.