GlobalFoundries Secures $2 Billion Supply Agreement with TSMC for AI Chip Components

GlobalFoundries has entered a five-year, $2 billion supply agreement with TSMC to provide silicon interposers for TSMC's CoWoS advanced packaging ecosystem, crucial for AI processing and memory chips. This deal necessitates an expansion of GF's manufacturing plant in Malta, New York, with volume production expected by the first half of 2028.