AI Interposers Grow Larger, Raising HBM4E Cooling Challenges for Samsung and SK Hynix

As AI packages expand to integrate more compute and memory, the interposers connecting chips and High Bandwidth Memory (HBM) are significantly increasing in size, posing substantial thermal management challenges for next-generation HBM4E. Samsung Electronics is reportedly developing new technologies to address these issues as it prepares for HBM4E mass production next year. This trend reflects the limits of process scaling and the growing adoption of chiplet-based 2.5D packaging in advanced AI systems.